1. Using picosecond or femtosecond laser, ultrashort pulse processing has no heat conduction. It is suitable for high-speed cutting and drilling of any organic-inorganic materials, with a minimum of 10 μ m edge collapse and heat affected zone.
2. Using double laser and double optical path splitting technology, double laser head processing, the efficiency is increased by one to two times.
3. CCD automatic positioning compensation deformation function is more suitable for product deformation, high configuration automatic edge searching cutting automatic compensation function can adapt to the deviation caused by stress processing in the previous process, and the cutting edge is more flat
4. Support a variety of visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc.
5. Automatic cleaning, visual inspection and sorting, automatic loading and unloading.
6. 8 years of R & D and design technology accumulation, stable performance and no consumables of laser micro machining system