CCD Tracing-edge Laser Cutting Machine
1. Product Introduction of the CCD Tracing-edge Laser Cutting Machine
▶High-performance, multi-purpose UV laser cutting machine Non-contact work platform with high-speed digital galvanometer processing. Avoid hidden damage caused by tool and die stress processing.
▶Using 355nm ultraviolet laser. short wavelength, high energy density, small thermal influence range, eliminating cooling water, cleaning water, cutting and dust accompanying mechanical processing, can quickly destroy the molecular structure of the substance to achieve cold processing.
▶The high-speed moving gantry structure and the design of the flying light path can be customized and equipped with a dedicated automatic loading and unloading machine, or matched with an SMT line.
▶It can recognize DXF and GERBER image files, eliminate molds, and realize rapid prototyping, cutting and drilling. It is especially suitable for processing complex, delicate and difficult products.
▶CCD automatic positioning compensation deformation function can be more adapted to the deformation of the product, and the highly configured automatic edge-finding and cutting automatic compensation function can adapt to the deviation caused by the stress processing in the previous process, and the cutting edge is more smooth.
▶The design of the double-station platform saves the time of manual or automatic manipulator replacement of materials, which exceeds the efficiency of the same type of equipment on the market by 30%.
▶Mobile phone camera module board, fingerprint recognition module cutting, T-card memory card, FPC flexible circuit board high-speed laser cutting, cutting thickness 1mm, processing without burrs, high precision, and small heat influence range.
▶Independently developed control software based on Windows, with full Chinese layout, and "one-key" operation is simple and quick.
2. Product Parameter (Specification) of the CCD Tracing-edge Laser Cutting Machine
|
Model |
CT-UV015D |
|
Name |
CCD Tracing-edge Laser Cutting Machine |
|
Laser |
355m wavelength, American light wave, SPI wave |
|
Laser Function |
1-20W adjustable |
|
Laser Pulse Frequency |
30KHZ-200KHZ adjustable |
|
Output Pulse Width |
≤20ns |
|
Pump Source Life |
|
|
Cutting Thickness |
1.5mm |
|
Galvanometer System |
SCANLAB-basiCube10 |
|
Scanning Range of Galvanometer |
50mm*50mm |
|
Cutting Efficiency |
100mm/s-cutting thickness affects cutting efficiency |
|
Focus Spot |
20±5um |
|
Cutting Slit Width |
20±5um |
|
Motion Platform |
Linear motor moving gantry |
|
Motion Platform Positioning Accuracy |
±3um |
|
Repeat Positioning Accuracy |
±2um |
|
Cutting Size |
350*500mm |
|
Expansion and Shrinkage Compensation Function |
Automatic expansion and contraction compensation according to the position of MAR point, uniform deformation file |
|
Comprehensive Machining Accuracy |
±30um |
|
Working Condition |
Temperature 25±5℃, no dew condensation, ground vibration acceleration (0.01mm/(s~2) |
|
Equipment Dimension |
L1770*W1350*H2050mm |
|
Power Consumption |
3.5KW/H with vacuum cleaner |
|
Equipment Weight |
Approx. 2500KG with vacuum cleaner |
|
Receiving File Format |
DXF and GERBER |
|
Identification System |
CCD positioning system, able to identify graphics positioning, with automatic positioning function |
3. Application field:
COB sub-board
Fingerprint recognition module cutting
Cover film (CVL)
